全球**的半導體制造工藝表征方案供應商Rudolph Technologies近日宣布推出NSXSeries晶圓檢測系統，該系統包括WaferWoRx探針工藝分析技術。NSXSeries可識別探針測試失效機制的根本原因，提供更快速的解決方案，改善成品率。     

“WaferWoRx的探針工藝分析技術是2007年我們決定收購AppliedPrecision半導體部門的主要原因。”Rudolph主席兼CEO Paul F.McLaughlin說道，“我們非常高興能成功的將WaferWoRx集成到業界**的NSX檢測平臺中，這標志著此次收購的成功。”

Rudolph Announces Probing Process Analysis Capability for NSXWafer Inspection System

New In-line Capability Provides Accelerated Probe Test FailureAnalysis and
Lower Cost of Ownership

FLANDERS, NEW JERSEY (February 9, 2009)─Rudolph Technologies,Inc. (NASDAQ: RTEC), a worldwide leader in process characterizationsolutions for the semiconductor manufacturing industry, todayannounced that the NSX? Series wafer inspection system now includesWaferWoRx? probing process analysis. The NSX Series can nowidentify the root cause of probe test failure mechanisms, providingfaster problem resolution and improved yield performance.

“The probing process analysis capability of the WaferWoRx was akey factor in our decision to acquire Applied Precision’sSemiconductor Division in 2007,” said Paul F. McLaughlin, Rudolph’schairman and chief executive officer. “We are pleased to announcethe successful integration of WaferWoRx with our industry-leadingNSX inspection platform, and we consider this milestone a testamentto the success of the acquisition.”

The NSX System detects probe marks and generates location andsize information as well as other parameters. WaferWoRx convertswhat has been a manual and time-consuming process of gatheringscrub data from various tools, correlating the data, and thensifting through for trends to an automated data collection andanalysis completed in a single step. WaferWoRx further enhances theprocess, breaking the overall probing error into its corecomponents (prober, probe card, setup), enabling rapid problemresolution. It can also pre-qualify test cells without risk toproduction wafers and evaluate the readiness of the probing processfor advanced technologies such as multi-DUT and high pin countprobe cards. Finally, probe card performance can be tracked topredict the need for maintenance, thereby extending card life andmaximizing card availability while avoiding the yield losses thatcan occur when a card fails during use.

According to Darren James, product manager for probe card testand analysis at Rudolph, “We have streamlined the approach toprobing process analysis. What was once an off-line, one-offprocedure that required extra time and equipment is now part of ahigh-throughput in-line system that can be used to identify theroot cause of the failure and accelerate its resolution.”
The NSX Series provides fast, repeatable, advanced macroinspection to detect defects created during wafer manufacturing,probing, bumping, and dicing or through general handling. Macrodefects (0.5 micron and larger) can have a major impact on thequality of a microelectronic device and the yield of themanufacturing process. The NSX uses high speed optical microscopyto identify defective probe marks. This same opticalcharacterization data from a well-designed sample of probe marksserves as the input to the WaferWoRx analysis module for processingand further identification of the error components.
The WaferWoRx probe process analysis capability is available nowon the NSX Series, and can be ordered as an upgrade for the NSX100, NSX 105 or NSX 115 models.

Rudolph Technologies is a worldwide leader in the design,development, manufacture and support of high-performance processcontrol metrology, defect inspection and data analysis systems usedby semiconductor device manufacturers. Rudolph provides a full-fabsolution through its families of proprietary products that providecritical yield-enhancing information, enabling microelectronicdevice manufacturers to drive down costs and time to market. Thecompany has enhanced the competitiveness of its products in themarketplace by anticipating and addressing many emerging trendsdriving the semiconductor industry's growth. Rudolph’s strategy forcontinued technological and market leadership includes aggressiveresearch and development of complementary metrology and inspectionsolutions. Headquartered in Flanders, New Jersey, Rudolph supportsits customers with a worldwide sales and service organization.Additional information can be found on the company’s web site atwww.rudolphtech.com. 

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This press release contains forward-looking statements within themeaning of the Private Securities Litigation Reform Act of 1995(the “Act”). In some cases, you can identify those so-called“forward-looking statements” by words such as “may,” “will,”“would,” “should,” “expects,” “plans,” “anticipates,” “believes,”“feels,” “estimates,” “predicts,” “potential,” or “continue,” orthe negative of those words and other comparable words. Rudolphwishes to take advantage of the “safe harbor” provided for by theAct and cautions that actual results may differ materially fromthose projected as a result of various factors, including risks anduncertainties, many of which are beyond Rudolph’s control. Factors that could cause actual results to differ materially fromthe expectations expressed in such forward-looking statements,include, but are not limited to, the impact of the slowdown in theoverall economy, the uncertainty of the current global politicalenvironment, the potential for terrorist attacks, the potential forbusiness disruptions due to infectious diseases, changes incustomer demands for our existing and new products, the timing,cancellation or delay of customer orders and shipments, the timingof revenue recognition of shipments, new product offerings from ourcompetitors, changes in or an inability to execute Rudolph’sbusiness strategy, unanticipated manufacturing or supply problemsand changes in tax rules. Rudolph cannot guarantee future results,levels of activity, performance, or achievements. The mattersdiscussed in this press release also involve risks anduncertainties as summarized in Rudolph’s Form 10-K report for theyear ended December 31, 2007 and other filings with the Securitiesand Exchange Commission (“SEC”), which are available at http://www.sec.gov, the SEC’s website,and at http://www.rudolphtech.com, theRudolph website. While these factors may be updated from time totime through the filing of reports and registration statements withthe SEC, Rudolph does not assume any obligation to update theforward-looking information contained in this pressrelease.